Session on
FRACTURE OF THERMAL SPRAY MATERIALS

Session Organizers: Christopher C. Berndt and Ahmet Kucuk

A session on "Fracture of Thermal Spray Materials" will be part of the congress. The topics in this session will include strength of coatings, fatigue, bonding and adhesion, residual stresses, and low and high temperature deformation. Papers on non-destructive testing of thermal spray materials and case studies are encouraged for submission. For further information, session organizers can be contacted at:

Prof. Christopher C. Berndt 307 Old Engineering Building Materials Sciences and Engineering Stony Brook University Stony Brook, New York 11794-2275 Tel: 631-632-8507 Fax: 631-632-8052 cberndt@notes.cc.sunysb.edu /berndt.html

Dr. Ahmet Kucuk B15 Old Engineering Building Materials Sciences and Engineering Stony Brook University Stony Brook, New York 11794-2275 Tel: 631-632-8486 Fax: 631-632-8052 akucuk@ms.cc.sunysb.edu http://ms.cc.sunysb.edu/~akucuk

Scope of the Congress Founded by Professor T. Yokobori in 1965, the International Congress on Fracture (ICF) is today the premier international body for promotion of world-wide cooperation among scientists and engineers concerned with the mechanics and mechanisms of fracture, fatigue and strength of solids. Over the years, ICF has made considerable progress in providing an international forum for highlighting individual and national accomplishments in the overall field of fracture. ICF10 - Key Deadlines Submission of Abstracts: 1 October 2000 Invitation for Full Papers Submission: 1 December 2000 Submission of Manuscripts: 1 February 2001 Acceptance Notification: 1 May 2001 Submission of Final Manuscripts: 1 June 2001 Presenters Registration Deadline: 1 August 2001 More Information Further information can be found at ICF10 homepage: http://www.elsevier.com/homepage/ sag/icf10/menu.htm .

Session Topics * Fracture of Thermal Spray Materials (C C Berndt, A Kucuk) * High Temperature Fracture (A Saxena, M Kitagawa) * Brittle Fracture (R Cook, T Iwadate, R Miyata) * Fatigue and Fracture (T Nicholas, M Jona, M Shimizu) * Creep and Corrosion Fatigue (R Gangloff, Y Kimura) * Impact, High Strain Rate (K Ravichandran, M Daimaruya, T Kobayshi) * Damage Mechanics (D Kracijnovic, A T Yokobori Jr, G Voyiadjis) * Failure Analysis (DRH Jones) * Physical Aspects of Fracture (E Bouchaud) * Nanoscale Problems (W W Gerberich, K Tanaka) * MEMS (O Sharpe, K Tanaka) * Micromechanics (N Ohno) * Nonlinear Fracture Mechancs (R H Dodds) * Computational Mechanics (R Phillips, S Yoshimura) * MD Simulations (O Zhou, M Kohyama) * Coatings/Interfaces (ND Thouless, T Aizawa, A Azushima) * Structural Integrity ( D M R Taplin) * Plant Aging (T Shoji) * NDE (M Enoki) * Image Analysis (S Sakai) * Experimental FM (A Shukla, T Sawada) * Electric Materials (R H Dauskardt, H Kawakami) * Electronic Packaging (T Suga) * Thin Films (H Matsubara) * Superconductors (K Salama) * Polymers (W Knauss, I Narisawa) * Ceramics (D Clarke, K White, K Niihara, S Wakayama, E Yasuda) * Composites (R Talreja, K Kageyama, S Ochiai, K Takahashi) * MMC, CMC (F Zok (CMC), S Johnson (MMC), Y W Mai, Y Kagawa) * Smart Structures (D Lagoudas, K Hirano, N Takeda) * Biomaterials (S M Teoh, A Nozue) * Concrete and Rock (S Shah, H Mihashi) * Geological problems (M Otsu, T Uomoto)