CLUSTER: PROPERTIES AND CHARACTERIZATION
Residual Stress - An Integrated Approach
Part 1: From Splats To Coatings
Jiri Matejicek, Sanjay Sampath - CTSR, SUNY at Stony Brook, NY
Paul Brand - NIST, Gaithersburg, MD

SCOPE AND CONNECTIONS

STRESS MEASUREMENT METHODS
Diffraction: 
*  x-rays: surface measurement 
*  neutrons: in-depth stress profiles 
- non-destructive 
- phase distinctive 
- moderate limitation on specimen shape + size 
- measure stress inside the splats 

Material removal: 
* hole-drilling, layer removal 
- can obtain stress gradient 
- destructive 
- risk of affecting the stress

Strip curvature: 
- non-destructive 
- easily applicable to graded coatings 
- limited specimen shape + size 
- can determine stress profiles in some cases 
- allows measurement of in-situ stress evolution 
Models: 
* numerical, analytical 
- concern: material properties 
- in conjunction with experiments, can separate 
  quenching and thermal stress 
 
 
THROUGH-THICKNESS STRESS PROFILE
 
 
XRD measurement: 
surface stresses in subsequent specimens 
of different thicknesses 
 
Calculation: 
stress profile in the entire deposit thickness 
calculated from XRD data 
 
EXAMPLE OF STRESS HISTORY
Neutron diffraction
msmt + calculation
 
   QS = quenching
         stress
TS = thermal
         stress
RS = residual
         stress
 

- measured values of residual stress + calculated values of thermal stress
=> determination of quenching stress
- quenching stress is dominant contributor to final stress values
- small difference in CTE => small thermal stress
- different proportion of quenching and thermal stress at different temperatures


STRESS ORIGIN AND SIGNIFICANCE

Origin of residual stress:
- quenching of the impinging splat, restricted contraction
? always tensile
- thermal mismatch between the coating and the substrate
? can be both tensile and compressive

Significance of stress:
- affects deformation behavior, lifetime, ultimately even structural integrity
- can be modified by varying the process conditions

Mechanisms of stress relaxation:
- plastic deformation, creep, annealing, cracking, intersplat sliding
- inelastic behavior makes theoretical predictions difficult
? experimental methods very important


SINGLE SPLATS AND THIN LAYERS
Mo - deposition temperature effects
 
 

- stress measured by x-ray diffraction and microdiffraction (splats)
- stress changes from tensile at low temperature to compressive at high temperature,
  due to increased contribution of thermal mismatch: CTE(Mo) < CTE(Fe)


THROUGH-THICKNESS STRESS PROFILE
 
 

- stress measured by neutron diffraction
- APS and wire-arc have both tensile and compressive stress in the deposit, with more
   tension near the surface
- HVOF has compressive stress, due to high-velocity-enabled peening action
- deposit stress accommodated by substrate bending


CONCLUSIONS
- stress in coatings can be studied by a variety of methods, depending on specimen dimensions
  and desired information
- stresses in single splats, surface layers and through-thickness stress profiles can be determined
- experimental methods complemented with calculations can isolate stress contributions at
  various stages of deposition process (quenching, thermal, residual stress)
- the effects of processing parameters on stress and related properties are elucidated,
  among which the deposition temperature plays prominent role
- by changing the temperature,one can achieve tensile or compressive stress in the deposit
Outcomes:
- better understanding of the process of coating build-up and stress evolution
- enables control of deposit properties and performance by process modification


For more information, contact:
Jiri Matejicek - jmatejic@mail.ic.sunysb.edu    Sanjay Sampath - ssampath@ms.cc.sunysb.edu
 
 See also… X. Jiang et al.: Splats - Experiments and Modeling;  Temperature Effects on Molybdenum Coatings
                   R. Neiser et al.: Plasma Spraying Process Maps
                   O. Kesler et al.: Residual Stress - Part 2
 
  back to the Nuggets page
back to the Center for Thermal Spray Research

VG 4/22/99