| Diffraction:
* x-rays: surface measurement * neutrons: in-depth stress profiles - non-destructive - phase distinctive - moderate limitation on specimen shape + size - measure stress inside the splats Material removal:
|
Strip curvature:
- non-destructive - easily applicable to graded coatings - limited specimen shape + size - can determine stress profiles in some cases - allows measurement of in-situ stress evolution Models: * numerical, analytical - concern: material properties - in conjunction with experiments, can separate quenching and thermal stress |
| XRD measurement:
surface stresses in subsequent specimens of different thicknesses |
Calculation:
stress profile in the entire deposit thickness calculated from XRD data |
- measured values of residual stress + calculated values of thermal
stress
=> determination of quenching stress
- quenching stress is dominant contributor to final stress values
- small difference in CTE => small thermal stress
- different proportion of quenching and thermal stress at different
temperatures
Origin of residual stress:
- quenching of the impinging splat, restricted contraction
? always tensile
- thermal mismatch between the coating and the substrate
? can be both tensile and compressive
Significance of stress:
- affects deformation behavior, lifetime, ultimately even structural
integrity
- can be modified by varying the process conditions
Mechanisms of stress relaxation:
- plastic deformation, creep, annealing, cracking, intersplat sliding
- inelastic behavior makes theoretical predictions difficult
? experimental methods very important
- stress measured by x-ray diffraction and microdiffraction (splats)
- stress changes from tensile at low temperature to compressive at
high temperature,
due to increased contribution of thermal mismatch: CTE(Mo) <
CTE(Fe)
- stress measured by neutron diffraction
- APS and wire-arc have both tensile and compressive stress in the
deposit, with more
tension near the surface
- HVOF has compressive stress, due to high-velocity-enabled peening
action
- deposit stress accommodated by substrate bending
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VG 4/22/99